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D860 Adhesive Tape

·Proper bond strength between the adhesive film and the carrier.

·Short time of melting bond and cooling solidification. 

·Adequate punching performance of the adhesive film.

·Good aging performance for high/low temperature. 

·Optimum bond & resilience strength. 

·Keeping good adhesion strength long time after embedding chip module.

·Adhesive type: copolyamide, suitable for PVC\ABS.


Recommended Parameters


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